chip defect meaning in English

小片缺陷
芯片缺陷

For the convenience of test , varied circuit chip defects caused by the production process are abstracted as all kinds of models . at present the commonly used fault models mainly consist of stuck - at fault , stuck - open fault , bridge fault , store fault , delay fault , etc . testing methods based on voltage testing mainly aim at stuck - at fault model and have also obtained satisfactory result in research for many years . bridge fault is tested easily by quiescent power supply current ( iddq ) testing method . in regard to stuck - open fault that is difficult to testd by quiescent power supply current ( iddq ) and voltage testing , it can is tested by the dynamic current ( iddt ) testing
为了便于测试,我们将生产过程中集成电路出现的多种多样的缺陷抽象为各种模型。目前常用的故障模型主要有:固定故障,开路故障,桥接故障,存储故障,时滞故障等。电压测试主要针对固定型故障模型,多年的研究也取得了令人满意的结果; cmos电路中的桥接故障则宜用稳态电流测试方法( iddq )测试;对于电压和稳态电流难以测试的开路故障,可以使用瞬态电流测试( iddt )的方法进行测试。